Power Relays
Both Say 1,500 V—but One Only Closes and Another Interrupts 1,000 A: The Hidden Traps in High-Voltage Relay Ratings
A 1,500 V label means little without the relay’s switching task, operating current and required life.
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Power Management ICs
800 VDC Is Rewriting the AI-Server Power BOM: Have China-Based SiC and GaN Suppliers Won Orders—or Only an Entry Ticket?
800 VDC creates a real opening, but design-in and volume delivery remain far beyond ecosystem entry.
Capacitors
Samsung Signs a Supply Deal, ADI Buys Empower: Who Is Winning Silicon-Capacitor Slots in AI and Optical-Module BOMs?
Silicon-capacitor competition now spans near-die decoupling, advanced packaging, broadband optical links and…
Microcontrollers (MCU)
China's MCU Market Moves Beyond Model Proliferation: The Next Contest Is to Become Engineers' Default Choice
China-based MCU vendors now cover nearly every major application tier. The harder task is turning broad cata…
SoCs & Special-Purpose ICs
Motorcomm's YT99 Is Already in Production Vehicles—So Why Is Yield Still Being Improved? A China-Developed TSN Switch Takes on Infineon and NXP
YT99 has crossed the line into production vehicles, but broader platform reuse still depends on configuratio…
Capacitors
From 1.6T to 3.2T Optics: Why a 22 nF Silicon Capacitor Must Fit 01005—and Be Characterized to 110 GHz
The move to 3.2T optics raises routing density and channel-loss demands. We examine how Launchip's 22 nF, 01…
SoCs & Special-Purpose ICs
YT8011, YT99 and YT78/79: Mapping Motorcomm's Full Automotive Connectivity Stack, Competitive Set and Remaining Gaps
Motorcomm’s PHY, TSN switch and SerDes lines differ sharply in maturity, reuse and interoperability.
Power Management ICs
Chipown Puts More Than Ten AI-Server Power Products into Production: From 800 V to 1 V, Why China-Based Suppliers Need a Platform Play
Chipown is assembling a power platform that spans 800 V auxiliary conversion, 48 V intermediate buses, multi…
Capacitors
AI-Server Power Makers Expand Snap-In Capacitor Capacity: Why Jianghai Is Betting on Aluminum Electrolytics, Hybrid Capacitors and MLPCs
Higher server power is creating different capacitor jobs at the high-voltage bus, intermediate outputs and l…
Memory
DDR4 Spot Prices Jump 20% in Two Months—but Trading Stalls: What the Supply-Demand Disconnect Really Means
DDR4 spot quotes are rising as major vendors redirect capacity, yet buyers remain reluctant to chase the mar…
Cameras & Imaging
Why ‘The Picture Looks Fine’ Is Not a Camera Production Test
GÖPEL's Video Dragon 6222 combines frame capture and generation to verify pixels, timing and sideband commun…
Power Distribution
AI Racks Are Now Liquid-Cooling the Power Busbar: What Molex's 15,000 A Claim Really Means
Molex's seven-channel liquid-cooled busbar is publicly rated up to 15,000 A with a 15°C temperature rise, wh…
Capacitors
Will Silicon Capacitors Replace MLCCs? Start with Effective Capacitance, Not the 1 μF Label
Three 1 μF parts from Yuyang Technology, TDK and Launchip solve different jobs. The real comparison is board…
Passive Components
Can a 35 A Common-Mode Choke Be Surface-Mounted? Three Tradeoffs Behind TDK EP21
TDK's EP21 brings 20.3–35 A ratings, low DCR and reflow assembly to a compact common-mode choke platform. Se…
Current & Voltage Sensing
Why TMR Sensors Are Challenging Hall Devices—and Why China-Made Alternatives Still Face an Automotive Qualification Gap
Infineon is pushing TMR into automotive angle, current and overcurrent sensing, while China-based suppliers …
Power Semiconductors
Infineon 100 V CoolGaN Enters BRC Solar Optimizers—Why Photovoltaics Chose GaN
BRC Solar has selected Infineon 100 V CoolGaN transistors for M600-E and M605-M module-level power optimizer…
NOR Flash
Automotive Flash Moves Beyond Parameter Matching: What 450 Million GigaDevice Shipments Really Show
GigaDevice says cumulative automotive-memory shipments exceeded 450 million units in July 2026. Domestic aut…
Test & Measurement
BGA Packages Make Probes Blind: How Boundary Scan Covers Automotive PCB Test Gaps
As BGA and QFN packages hide more joints and dense boards lose physical test points, Boundary Scan restores …
Battery Management ICs
Domestic 18-Cell BMS AFEs Enter Production—Why ADC Accuracy Is Not the Hardest Part to Replace
Domestic 18-cell BMS AFEs have crossed the product-availability threshold. Substitution depends less on whet…
Isolated Power Modules
TI Integrates the Transformer in 1.5 W Isolated Power Modules for AI Server Bias Rails
TI UCC34141-Q1 and UCC33420 integrate the planar transformer, isolated power stage, and protection for gate-…
Silicon Capacitors
Low-ESL Decoupling for AI Chip PDNs: from Three-Terminal MLCCs to Launchip's 49-Terminal Silicon Capacitor
As capacitors move from the PCB toward the die, selection depends on the current path as well as capacitance…
Multilayer Ceramic Capacitors (MLCC)
MLCC Increases by Exact Part: X5R Inventory Falls, but Which Signals Show a Real Shortage?
The ic.net dashboard shows a 33.4% increase in the X5R price index and a 28.9% decline in its inventory inde…
FPGA
Altera Agilex 9 AGRW039 Integrates RF and Compute—Will Radar Architecture Change?
The Agilex 9 Direct RF-Series AGRW039 brings eight 10-bit receive ADCs, eight transmit DACs, programmable lo…
Components
NXP Brings a 16-Bit ADC to Entry MCUs—How Domestic General and Motor-Control Parts Respond
NXP MCX C15/C16 integrates analog and power-control peripherals at the entry level. GigaDevice GD32E230, Gee…
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